|
At Aeroflex our goal is to identify and develop our most important asset, our people. We seek to
hire talented employees, provide them with the right expectations of their job, and reward and
recognize them for their contributions.
We believe in creating a learning environment where employees have the opportunity to continue
their own personal growth and development.
We are firmly dedicated to the continued prosperity of Aeroflex and are always looking for
talented individuals to join our team. It is our goal to treat each employee with courtesy
and dignity and realize the importance in earning your trust and confidence in the company.
Aeroflex is an Equal Opportunity Employer. It is our policy to attract and retain the best
qualified personnel without regard to race, color, religion, sex, age, national origin,
status as a disabled or Vietnam-era veteran, or the presence of a disability.
This policy applies to all applicants and employees and includes all conditions of employment.
Sr. or Pr. Package Design Engineer
| Reference Number: |
09.610.03 |
| Date Posted: |
01/22/2010 |
| Number of Positions: |
1 |
| Location: |
Aeroflex Colorado Springs
USA |
Position Summary
This candidate will support /Lead process and package development efforts for semi-conductor related projects. Responsibilities range from concept definitions and design, package design, process design materials selection, evaluation, reliability evaluation and transfer to manufacturing. Projects supported include ceramic high reliability packaging, plastic encapsulation, flip chip assembly, assembly on flex substrates and chip on board (COB). Candidate must be highly motivated, creative, detail oriented and schedule driven. Good communication and documentation skills are required. Candidate will perform hands-on process development using existing equipment and will identify and recommend new equipment needed. Must have strong project management skills.
|
Requirements
Government Clearance desired, but not required. Education: BS/MS Mechanical Engineering or Material Science Preferred. Specialized training or experience necessary to perform the job: Candidate should have related experience in semi-conductor assembly, packaging design and process development. Candidate should have good CAD modeling skills using Solidworks or similar software. Familiarity with Mil-Std-883 requirements is preferred.
|
To apply, please submit a resume to:
Aeroflex Colorado Springs
Human Resources
4350 Centennial Blvd.
Colorado Springs, CO 80907 [USA]
Fax: (719) 594-8187
Or submit via e-mail to hr.coloradosprings@aeroflex.com.
All positions are subject to a satisfactory pre-offer background check.
|
